Packaging Module Development Engineer

Intel is seeking a Packaging Module Development Engineer to join their Advanced Packaging Technology & Manufacturing team in Chandler, Arizona. In this role, the engineer will focus on designing, optimizing, and qualifying assembly processes and equipment essential for Intel's advanced semiconductor products. Daily tasks will involve leading experimental designs and process characterization using methodologies such as Design of Experiments (DOE) and Statistical Process Control (SPC). The position requires innovation in techniques, materials, and tools to tackle challenges related to packaging quality and reliability. Collaboration with cross-functional teams is essential to identify and mitigate technical risks throughout product development. While the advert does not specify required qualifications or experience, the role is suited for individuals who are driven and eager to contribute to the future of semiconductor technology. The working arrangement details are not provided, but the position is based in an office environment at one of Intel's advanced facilities.