Wafer Sort & C4 Bump Module Equipment Technician

Intel is seeking a Wafer Sort & C4 Bump Module Equipment Technician in Penang, Malaysia. The role involves troubleshooting electrical, mechanical, and electronic issues in semiconductor manufacturing equipment. Daily tasks include equipment setup, calibration, preventive maintenance, and repairs, all performed according to established procedures and safety standards. The technician will monitor equipment performance, analyze manufacturing data, and respond to alarms and interruptions to maintain operational efficiency. Collaboration with Module Engineering is essential for troubleshooting and executing experiments aimed at improving equipment reliability and performance. The position requires familiarity with Statistical Process Control (SPC) and the ability to coordinate with original equipment manufacturers for technical support. While the advert does not specify required qualifications or experience, the role is suited for individuals with a strong technical background in equipment maintenance and troubleshooting. The working arrangement details are not provided, but the position appears to be focused on hands-on technical work in a manufacturing environment.